Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337132 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Ming Sun, Kai Liu, Xiaotian Zhang, Yueh-Se Ho | 2016-05-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337132 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Ming Sun, Kai Liu, Xiaotian Zhang, Yueh-Se Ho | 2016-05-10 |