Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443815 | Embedded die redistribution layers for active device | Kai Liu, Satbir Madra | 2016-09-13 |
| 9397027 | Sacrificial pad on semiconductor package device and method | Xiansong Chen, Yi-Sheng Anthony Sun, Satbir Madra, Yong Li Xu | 2016-07-19 |
| 9354111 | Wafer level lens in package | Nicole D. Kerness, Arkadii V. Samoilov, Jerome Chandra Bhat, Anand Chamakura, Christopher F. Edwards | 2016-05-31 |