Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472696 | Light sensor having a contiguous IR suppression filter and transparent substrate | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2016-10-18 |
| 9472586 | Light sensor having transparent substrate and through-substrate vias and a contiguous IR suppression filter | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2016-10-18 |
| 9425160 | Wafer-level package device with solder bump reinforcement | Reynante Tamunan Alvarado, Yi-Sheng Anthony Sun, Yong Li Xu | 2016-08-23 |
| 9354111 | Wafer level lens in package | Nicole D. Kerness, Jerome Chandra Bhat, Anand Chamakura, Kumar Nagarajan, Christopher F. Edwards | 2016-05-31 |
| 9343430 | Stacked wafer-level package device | Tie Wang, Yi-Sheng Anthony Sun | 2016-05-17 |
| 9322901 | Multichip wafer level package (WLP) optical device | Nicole D. Kerness, Joy T. Jones, Christopher F. Edwards, Phillip J. Benzel, Richard Ian Olsen +1 more | 2016-04-26 |
| 9230903 | Multi-die, high current wafer level package | Peter R. Harper, Viren Khandekar, Pirooz Parvarandeh | 2016-01-05 |