Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425160 | Wafer-level package device with solder bump reinforcement | Reynante Tamunan Alvarado, Arkadii V. Samoilov, Yong Li Xu | 2016-08-23 |
| 9397027 | Sacrificial pad on semiconductor package device and method | Xiansong Chen, Kumar Nagarajan, Satbir Madra, Yong Li Xu | 2016-07-19 |
| 9343430 | Stacked wafer-level package device | Arkadii V. Samoilov, Tie Wang | 2016-05-17 |