Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425160 | Wafer-level package device with solder bump reinforcement | Yi-Sheng Anthony Sun, Arkadii V. Samoilov, Yong Li Xu | 2016-08-23 |
| 9379065 | Crack stopping structure in wafer level packaging (WLP) | Lizabeth Keser, Zhongping Bao | 2016-06-28 |