Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406649 | Stacked multi-chip integrated circuit package | Dongming He, Zhenyu Huang | 2016-08-02 |
| 9379065 | Crack stopping structure in wafer level packaging (WLP) | Lizabeth Keser, Reynante Tamunan Alvarado | 2016-06-28 |
| 9263186 | DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor | Yue Li, Xiaoming Chen, Charles David Paynter, Xiaonan Zhang, Ryan David Lane | 2016-02-16 |