| 9514966 |
Apparatus and methods for shielding differential signal pin pairs |
Siamak Fazelpour, Charles David Paynter |
2016-12-06 |
| 9484281 |
Systems and methods for thermal dissipation |
Charles David Paynter |
2016-11-01 |
| 9449762 |
Embedded package substrate capacitor with configurable/controllable equivalent series resistance |
Young Kyu Song, Kyu-Pyung Hwang, Dong Wook Kim, Xiaonan Zhang |
2016-09-20 |
| 9379090 |
System, apparatus, and method for split die interconnection |
Ahmer Syed, Chin-Kwan Kim, Omar J. Bchir, Milind Shah |
2016-06-28 |
| 9373583 |
High quality factor filter implemented in wafer level packaging (WLP) integrated device |
Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei-Ming Jow, Xiaonan Zhang |
2016-06-21 |
| 9368566 |
Package on package (PoP) integrated device comprising a capacitor in a substrate |
Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow +3 more |
2016-06-14 |
| 9362218 |
Integrated passive device (IPD) on substrate |
Daeik Daniel Kim, Young Kyu Song, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +2 more |
2016-06-07 |
| 9324779 |
Toroid inductor in an integrated device |
Young Kyu Song, Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Mario Francisco Velez +2 more |
2016-04-26 |
| 9263186 |
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor |
Yue Li, Xiaoming Chen, Zhongping Bao, Charles David Paynter, Xiaonan Zhang |
2016-02-16 |
| 9245940 |
Inductor design on floating UBM balls for wafer level package (WLP) |
Young Kyu Song, Yunseo Park, Xiaonan Zhang, Aristotele Hadjichristos |
2016-01-26 |