Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514966 | Apparatus and methods for shielding differential signal pin pairs | Siamak Fazelpour, Charles David Paynter | 2016-12-06 |
| 9484281 | Systems and methods for thermal dissipation | Charles David Paynter | 2016-11-01 |
| 9449762 | Embedded package substrate capacitor with configurable/controllable equivalent series resistance | Young Kyu Song, Kyu-Pyung Hwang, Dong Wook Kim, Xiaonan Zhang | 2016-09-20 |
| 9379090 | System, apparatus, and method for split die interconnection | Ahmer Syed, Chin-Kwan Kim, Omar J. Bchir, Milind Shah | 2016-06-28 |
| 9373583 | High quality factor filter implemented in wafer level packaging (WLP) integrated device | Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei-Ming Jow, Xiaonan Zhang | 2016-06-21 |
| 9368566 | Package on package (PoP) integrated device comprising a capacitor in a substrate | Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow +3 more | 2016-06-14 |
| 9362218 | Integrated passive device (IPD) on substrate | Daeik Daniel Kim, Young Kyu Song, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo +2 more | 2016-06-07 |
| 9324779 | Toroid inductor in an integrated device | Young Kyu Song, Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Mario Francisco Velez +2 more | 2016-04-26 |
| 9263186 | DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor | Yue Li, Xiaoming Chen, Zhongping Bao, Charles David Paynter, Xiaonan Zhang | 2016-02-16 |
| 9245940 | Inductor design on floating UBM balls for wafer level package (WLP) | Young Kyu Song, Yunseo Park, Xiaonan Zhang, Aristotele Hadjichristos | 2016-01-26 |