Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484327 | Package-on-package structure with reduced height | Chin-Kwan Kim, Omar J. Bchir, Marcus HSU, David Fraser Rae | 2016-11-01 |
| 9466578 | Substrate comprising improved via pad placement in bump area | Jie Fu, Manuel Aldrete | 2016-10-11 |
| 9379090 | System, apparatus, and method for split die interconnection | Ahmer Syed, Chin-Kwan Kim, Omar J. Bchir, Ryan David Lane | 2016-06-28 |
| 9269681 | Surface finish on trace for a thermal compression flip chip (TCFC) | Houssam Jomaa, Omar J. Bchir, Manuel Aldrete, Chin-Kwan Kim | 2016-02-23 |