| 9484327 |
Package-on-package structure with reduced height |
Omar J. Bchir, Milind Shah, Marcus HSU, David Fraser Rae |
2016-11-01 |
| 9379090 |
System, apparatus, and method for split die interconnection |
Ahmer Syed, Omar J. Bchir, Milind Shah, Ryan David Lane |
2016-06-28 |
| 9370097 |
Package substrate with testing pads on fine pitch traces |
Kuiwon Kang, Omar J. Bchir |
2016-06-14 |
| 9355963 |
Semiconductor package interconnections and method of making the same |
Dong Wook Kim, Jae Sik Lee, Hong Bok We, Young Kyu Song, Kyu-Pyung Hwang +1 more |
2016-05-31 |
| 9269610 |
Pattern between pattern for low profile substrate |
Hong Bok We, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang, Young Kyu Song |
2016-02-23 |
| 9269681 |
Surface finish on trace for a thermal compression flip chip (TCFC) |
Houssam Jomaa, Omar J. Bchir, Milind Shah, Manuel Aldrete |
2016-02-23 |