| 9472425 |
Power distribution improvement using pseudo-ESR control of an embedded passive capacitor |
Young Kyu Song, Kyu-Pyung Hwang |
2016-10-18 |
| 9466554 |
Integrated device comprising via with side barrier layer traversing encapsulation layer |
Hong Bok We, Dong Wook Kim, Shiqun Gu |
2016-10-11 |
| 9456963 |
Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base |
— |
2016-10-04 |
| 9443824 |
Cavity bridge connection for die split architecture |
Hong Bok We, Dong Wook Kim |
2016-09-13 |
| 9418877 |
Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers |
Shiqun Gu, Ratibor Radojcic, Dong Wook Kim |
2016-08-16 |
| 9401350 |
Package-on-package (POP) structure including multiple dies |
Hong Bok We, Dong Wook Kim, Shiqun Gu |
2016-07-26 |
| 9368450 |
Integrated device package comprising bridge in litho-etchable layer |
Shiqun Gu, Hong Bok We, Dong Wook Kim |
2016-06-14 |
| 9355963 |
Semiconductor package interconnections and method of making the same |
Dong Wook Kim, Hong Bok We, Young Kyu Song, Chin-Kwan Kim, Kyu-Pyung Hwang +1 more |
2016-05-31 |
| 9269610 |
Pattern between pattern for low profile substrate |
Hong Bok We, Chin-Kwan Kim, Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song |
2016-02-23 |
| 9230936 |
Integrated device comprising high density interconnects and redistribution layers |
Dong Wook Kim, Hong Bok We, Shiqun Gu |
2016-01-05 |