| 9478528 |
Devices, systems and methods using through silicon optical interconnects |
Kenneth Kaskoun, Matthew Michael Nowak |
2016-10-25 |
| 9466554 |
Integrated device comprising via with side barrier layer traversing encapsulation layer |
Jae Sik Lee, Hong Bok We, Dong Wook Kim |
2016-10-11 |
| 9431298 |
Integrated circuit chip customization using backside access |
Daniel Wayne Perry |
2016-08-30 |
| 9425096 |
Air gap between tungsten metal lines for interconnects with reduced RC delay |
Matthew Michael Nowak, Jeffrey Junhao Xu |
2016-08-23 |
| 9418877 |
Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers |
Ratibor Radojcic, Dong Wook Kim, Jae Sik Lee |
2016-08-16 |
| 9401350 |
Package-on-package (POP) structure including multiple dies |
Hong Bok We, Jae Sik Lee, Dong Wook Kim |
2016-07-26 |
| 9401353 |
Interposer integrated with 3D passive devices |
Vidhya Ramachandran |
2016-07-26 |
| 9379201 |
Electrostatic discharge diodes and methods of forming electrostatic discharge diodes |
Vidhya Ramachandran, Brian Matthew Henderson, Chiew-Guan Tan, Jung Pill Kim, Taehyun Kim |
2016-06-28 |
| 9368716 |
Magnetic tunnel junction (MTJ) storage element and spin transfer torque magnetoresistive random access memory (STT-MRAM) cells having an MTJ |
Seung H. Kang, Xiaochun Zhu |
2016-06-14 |
| 9368450 |
Integrated device package comprising bridge in litho-etchable layer |
Hong Bok We, Jae Sik Lee, Dong Wook Kim |
2016-06-14 |
| 9355963 |
Semiconductor package interconnections and method of making the same |
Dong Wook Kim, Jae Sik Lee, Hong Bok We, Young Kyu Song, Chin-Kwan Kim +1 more |
2016-05-31 |
| 9355904 |
Method for strain-relieved through substrate vias |
Vidhya Ramachandran |
2016-05-31 |
| 9318696 |
Self-aligned top contact for MRAM fabrication |
Yu Lu, Xia Li, Seung H. Kang |
2016-04-19 |
| 9276199 |
Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) |
Rongtian Zhang, Vidhya Ramachandran, Dong Wook Kim |
2016-03-01 |
| 9268720 |
Load balancing scheme in multiple channel DRAM systems |
Feng Wang, Jonghae Kim, Matthew Michael Nowak |
2016-02-23 |
| 9230936 |
Integrated device comprising high density interconnects and redistribution layers |
Dong Wook Kim, Hong Bok We, Jae Sik Lee |
2016-01-05 |