| 9502490 |
Embedded package substrate capacitor |
Kyu-Pyung Hwang, Young Kyu Song, Dong Wook Kim |
2016-11-22 |
| 9490226 |
Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal |
Young Kyu Song, Dong Wook Kim, Kyu-Pyung Hwang |
2016-11-08 |
| 9466554 |
Integrated device comprising via with side barrier layer traversing encapsulation layer |
Jae Sik Lee, Dong Wook Kim, Shiqun Gu |
2016-10-11 |
| 9443824 |
Cavity bridge connection for die split architecture |
Jae Sik Lee, Dong Wook Kim |
2016-09-13 |
| 9401350 |
Package-on-package (POP) structure including multiple dies |
Jae Sik Lee, Dong Wook Kim, Shiqun Gu |
2016-07-26 |
| 9385077 |
Integrated device comprising coaxial interconnect |
Dong Wook Kim, Young Kyu Song, Kyu-Pyung Hwang |
2016-07-05 |
| 9368450 |
Integrated device package comprising bridge in litho-etchable layer |
Shiqun Gu, Jae Sik Lee, Dong Wook Kim |
2016-06-14 |
| 9355963 |
Semiconductor package interconnections and method of making the same |
Dong Wook Kim, Jae Sik Lee, Young Kyu Song, Chin-Kwan Kim, Kyu-Pyung Hwang +1 more |
2016-05-31 |
| 9269610 |
Pattern between pattern for low profile substrate |
Chin-Kwan Kim, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang, Young Kyu Song |
2016-02-23 |
| 9230936 |
Integrated device comprising high density interconnects and redistribution layers |
Dong Wook Kim, Jae Sik Lee, Shiqun Gu |
2016-01-05 |