YS

Young Kyu Song

QU Qualcomm: 20 patents #61 of 3,136Top 2%
📍 San Diego, CA: #45 of 4,446 inventorsTop 2%
🗺 California: #253 of 57,791 inventorsTop 1%
Overall (2016): #1,365 of 481,213Top 1%
20
Patents 2016

Issued Patents 2016

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
9530739 Package on package (PoP) device comprising a high performance inter package connection Kyu-Pyung Hwang 2016-12-27
9502491 Embedded sheet capacitor Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun 2016-11-22
9502490 Embedded package substrate capacitor Hong Bok We, Kyu-Pyung Hwang, Dong Wook Kim 2016-11-22
9490226 Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang 2016-11-08
9472425 Power distribution improvement using pseudo-ESR control of an embedded passive capacitor Kyu-Pyung Hwang, Jae Sik Lee 2016-10-18
9449762 Embedded package substrate capacitor with configurable/controllable equivalent series resistance Kyu-Pyung Hwang, Dong Wook Kim, Xiaonan Zhang, Ryan David Lane 2016-09-20
9443810 Flip-chip employing integrated cavity filter, and related components, systems, and methods John Jong-Suk Lee, Uei-Ming Jow, Sangjo Choi, Xiaonan Zhang 2016-09-13
9425143 Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield Kyu-Pyung Hwang 2016-08-23
9385077 Integrated device comprising coaxial interconnect Dong Wook Kim, Kyu-Pyung Hwang, Hong Bok We 2016-07-05
9373583 High quality factor filter implemented in wafer level packaging (WLP) integrated device Jong-Hoon Lee, Jung Ho Yoon, Uei-Ming Jow, Xiaonan Zhang, Ryan David Lane 2016-06-21
9368566 Package on package (PoP) integrated device comprising a capacitor in a substrate Jong-Hoon Lee, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow, Mario Francisco Velez +3 more 2016-06-14
9362218 Integrated passive device (IPD) on substrate Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +2 more 2016-06-07
9355963 Semiconductor package interconnections and method of making the same Dong Wook Kim, Jae Sik Lee, Hong Bok We, Chin-Kwan Kim, Kyu-Pyung Hwang +1 more 2016-05-31
9335384 Adjustable magnetic probe for efficient near field scanning Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun 2016-05-10
9324779 Toroid inductor in an integrated device Daeik Daniel Kim, Jonghae Kim, Xiaonan Zhang, Ryan David Lane, Mario Francisco Velez +2 more 2016-04-26
9294064 Bandpass filter implementation on a single layer using spiral capacitors Kyu-Pyung Hwang, Changhan Hobie Yun, Dong Wook Kim 2016-03-22
9275876 Stiffener with embedded passive components Dong Wook Kim, Kyu-Pyung Hwang, Changhan Hobie Yun 2016-03-01
9269610 Pattern between pattern for low profile substrate Hong Bok We, Chin-Kwan Kim, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang 2016-02-23
9247647 High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB) Jung Ho Yoon, Xiaonan Zhang, Jong-Hoon Lee, Uei-Ming Jow 2016-01-26
9245940 Inductor design on floating UBM balls for wafer level package (WLP) Yunseo Park, Xiaonan Zhang, Ryan David Lane, Aristotele Hadjichristos 2016-01-26