| 9502586 |
Backside coupled symmetric varactor structure |
David Francis Berdy, Je-Hsiung Lan, Changhan Hobie Yun, Jonghae Kim |
2016-11-22 |
| 9478348 |
Vertical spiral inductor |
Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy, Jonghae Kim |
2016-10-25 |
| 9468098 |
Face-up substrate integration with solder ball connection in semiconductor package |
Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka |
2016-10-11 |
| 9461614 |
Asymmetric unbalanced acoustically coupled resonators for spurious mode suppression |
Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim |
2016-10-04 |
| 9449753 |
Varying thickness inductor |
Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang +2 more |
2016-09-20 |
| 9425761 |
High pass filters and low pass filters using through glass via technology |
Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Mario Francisco Velez, Je-Hsiung Lan +2 more |
2016-08-23 |
| 9384883 |
Nested through glass via transformer |
Jonghae Kim, Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun |
2016-07-05 |
| 9379686 |
Resonator with a staggered electrode configuration |
Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Rick A. Wilcox |
2016-06-28 |
| 9368566 |
Package on package (PoP) integrated device comprising a capacitor in a substrate |
Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei-Ming Jow, Mario Francisco Velez +3 more |
2016-06-14 |
| 9368564 |
3D pillar inductor |
Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Mario Francisco Velez |
2016-06-14 |
| 9370103 |
Low package parasitic inductance using a thru-substrate interposer |
Changhan Hobie Yun, Chengjie Zuo, Jonghae Kim, Mario Francisco Velez |
2016-06-14 |
| 9361160 |
Virtualization across physical partitions of a multi-core processor (MCP) |
Karl J. Duvalsaint, Harm Peter Hofstee, Moon J. Kim |
2016-06-07 |
| 9362218 |
Integrated passive device (IPD) on substrate |
Young Kyu Song, Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim +2 more |
2016-06-07 |
| 9355967 |
Stress compensation patterning |
Je-Hsiung Lan, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun |
2016-05-31 |
| 9343403 |
Stress mitigation structure for wafer warpage reduction |
Je-Hsiung Lan, David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez +3 more |
2016-05-17 |
| 9343399 |
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology |
Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez +2 more |
2016-05-17 |
| 9337199 |
Semiconductor device and method of fabricating the same |
Jiyoung Kim, Sungho Jang, Kang-Uk Kim, Kyung Eun Kim, Hyoungsub Kim +4 more |
2016-05-10 |
| 9324779 |
Toroid inductor in an integrated device |
Young Kyu Song, Jonghae Kim, Xiaonan Zhang, Ryan David Lane, Mario Francisco Velez +2 more |
2016-04-26 |
| 9275786 |
Superposed structure 3D orthogonal through substrate inductor |
David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka +1 more |
2016-03-01 |
| 9264013 |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Changhan Hobie Yun, Je-Hsiung Lan +2 more |
2016-02-16 |
