| 9468098 |
Face-up substrate integration with solder ball connection in semiconductor package |
Daeik Daniel Kim, Jonghae Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez |
2016-10-11 |
| 9449753 |
Varying thickness inductor |
Daeik Daniel Kim, Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Xiangdong Zhang +2 more |
2016-09-20 |
| 9425761 |
High pass filters and low pass filters using through glass via technology |
Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Daeik Daniel Kim, Mario Francisco Velez +2 more |
2016-08-23 |
| 9343403 |
Stress mitigation structure for wafer warpage reduction |
Je-Hsiung Lan, David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun +3 more |
2016-05-17 |
| 9343399 |
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology |
Je-Hsiung Lan, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim, Daeik Daniel Kim +2 more |
2016-05-17 |
| 9331666 |
Composite dilation mode resonators |
Chengjie Zuo, Jonghae Kim, Changhan Hobie Yun, Sang-June Park, Philip Jason Stephanou +4 more |
2016-05-03 |
| 9275786 |
Superposed structure 3D orthogonal through substrate inductor |
David Francis Berdy, Chengjie Zuo, Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez +1 more |
2016-03-01 |
| 9264013 |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
Chengjie Zuo, Jonghae Kim, Daeik Daniel Kim, Mario Francisco Velez, Changhan Hobie Yun +2 more |
2016-02-16 |