Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443810 | Flip-chip employing integrated cavity filter, and related components, systems, and methods | John Jong-Suk Lee, Young Kyu Song, Sangjo Choi, Xiaonan Zhang | 2016-09-13 |
| 9373583 | High quality factor filter implemented in wafer level packaging (WLP) integrated device | Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Xiaonan Zhang, Ryan David Lane | 2016-06-21 |
| 9368566 | Package on package (PoP) integrated device comprising a capacitor in a substrate | Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Mario Francisco Velez +3 more | 2016-06-14 |
| 9247647 | High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB) | Jung Ho Yoon, Xiaonan Zhang, Jong-Hoon Lee, Young Kyu Song | 2016-01-26 |