Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9460980 | Systems, apparatus, and methods for heat dissipation | Sun Woong Yun, Rajneesh Kumar, Joan Rey Villarba BUOT | 2016-10-04 |
| 9398699 | Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same | Omar J. Bchir | 2016-07-19 |
| 9355898 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Rajneesh Kumar, David Fraser Rae, Layal Rouhana, Omar J. Bchir | 2016-05-31 |
| 9269681 | Surface finish on trace for a thermal compression flip chip (TCFC) | Omar J. Bchir, Milind Shah, Manuel Aldrete, Chin-Kwan Kim | 2016-02-23 |