Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484327 | Package-on-package structure with reduced height | Chin-Kwan Kim, Omar J. Bchir, Milind Shah, Marcus HSU | 2016-11-01 |
| 9355898 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Rajneesh Kumar, Houssam Jomaa, Layal Rouhana, Omar J. Bchir | 2016-05-31 |