MH

Marcus HSU

QU Qualcomm: 1 patents #1,517 of 3,136Top 50%
Overall (2016): #306,276 of 481,213Top 65%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9484327 Package-on-package structure with reduced height Chin-Kwan Kim, Omar J. Bchir, Milind Shah, David Fraser Rae 2016-11-01