| 9484327 |
Package-on-package structure with reduced height |
Chin-Kwan Kim, Milind Shah, Marcus HSU, David Fraser Rae |
2016-11-01 |
| 9461008 |
Solder on trace technology for interconnect attachment |
Rajneesh Kumar |
2016-10-04 |
| 9398699 |
Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
Houssam Jomaa |
2016-07-19 |
| 9379090 |
System, apparatus, and method for split die interconnection |
Ahmer Syed, Chin-Kwan Kim, Milind Shah, Ryan David Lane |
2016-06-28 |
| 9370097 |
Package substrate with testing pads on fine pitch traces |
Chin-Kwan Kim, Kuiwon Kang |
2016-06-14 |
| 9355898 |
Package on package (PoP) integrated device comprising a plurality of solder resist layers |
Rajneesh Kumar, Houssam Jomaa, David Fraser Rae, Layal Rouhana |
2016-05-31 |
| 9269681 |
Surface finish on trace for a thermal compression flip chip (TCFC) |
Houssam Jomaa, Milind Shah, Manuel Aldrete, Chin-Kwan Kim |
2016-02-23 |