Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466578 | Substrate comprising improved via pad placement in bump area | Jie Fu, Milind Shah | 2016-10-11 |
| 9313881 | Through mold via relief gutter on molded laser package (MLP) packages | Christopher J. Healy, Gopal C. Jha | 2016-04-12 |
| 9269681 | Surface finish on trace for a thermal compression flip chip (TCFC) | Houssam Jomaa, Omar J. Bchir, Milind Shah, Chin-Kwan Kim | 2016-02-23 |