CH

Christopher J. Healy

QU Qualcomm: 1 patents #1,517 of 3,136Top 50%
Overall (2016): #441,955 of 481,213Top 95%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9313881 Through mold via relief gutter on molded laser package (MLP) packages Gopal C. Jha, Manuel Aldrete 2016-04-12