GJ

Gopal C. Jha

QU Qualcomm: 1 patents #1,517 of 3,136Top 50%
Overall (2016): #392,763 of 481,213Top 85%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9313881 Through mold via relief gutter on molded laser package (MLP) packages Christopher J. Healy, Manuel Aldrete 2016-04-12