Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379065 | Crack stopping structure in wafer level packaging (WLP) | Zhongping Bao, Reynante Tamunan Alvarado | 2016-06-28 |
| 9318405 | Wafer level package without sidewall cracking | Jianwen Xu, William Stone, Steve Joseph Bezuk, Nicholas Yu | 2016-04-19 |