WS

William Stone

QU Qualcomm: 1 patents #1,517 of 3,136Top 50%
Overall (2016): #184,430 of 481,213Top 40%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9318405 Wafer level package without sidewall cracking Jianwen Xu, Lizabeth Keser, Steve Joseph Bezuk, Nicholas Yu 2016-04-19