Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425160 | Wafer-level package device with solder bump reinforcement | Reynante Tamunan Alvarado, Yi-Sheng Anthony Sun, Arkadii V. Samoilov | 2016-08-23 |
| 9397027 | Sacrificial pad on semiconductor package device and method | Xiansong Chen, Yi-Sheng Anthony Sun, Kumar Nagarajan, Satbir Madra | 2016-07-19 |