Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443762 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn | 2016-09-13 |
| 9263361 | Semiconductor device having a vertical interconnect structure using stud bumps | Reza A. Pagaila, Byung Tai Do, Rajendra D. Pendse | 2016-02-16 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Nathapong Suthiwongsunthorn, Dioscoro A. Merilo | 2016-01-12 |