| 9484319 |
Semiconductor device and method of forming extended semiconductor device with fan-out interconnect structure to reduce complexity of substrate |
— |
2016-11-01 |
| 9472533 |
Semiconductor device and method of forming wire bondable fan-out EWLB package |
— |
2016-10-18 |
| 9385074 |
Semiconductor package with embedded die |
— |
2016-07-05 |
| 9385101 |
Semiconductor device and method of forming bump-on-lead interconnection |
— |
2016-07-05 |
| 9379084 |
Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask |
— |
2016-06-28 |
| 9373573 |
Solder joint flip chip interconnection |
KyungOe Kim, TaeWoo Kang |
2016-06-21 |
| 9345148 |
Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad |
— |
2016-05-17 |
| 9312150 |
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package |
Nazir Ahmad, Young Do Kweon, Samuel Tam, Kyung-Moon Kim |
2016-04-12 |
| 9263361 |
Semiconductor device having a vertical interconnect structure using stud bumps |
Reza A. Pagaila, Byung Tai Do, Shuangwu Huang |
2016-02-16 |
| 9258904 |
Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings |
— |
2016-02-09 |