Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2016-08-09 |
| 9373573 | Solder joint flip chip interconnection | Rajendra D. Pendse, TaeWoo Kang | 2016-06-21 |