Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9514925 | Protective coating for silicon substrate | Tak Shing Pang | 2016-12-06 | $57,115,000 |
| 9419032 | Wafer level camera module with molded housing and method of manufacturing | Harpuneet Singh, Dongkai Shangguan | 2016-08-16 | |
| 9312150 | Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package | Nazir Ahmad, Young Do Kweon, Kyung-Moon Kim, Rajendra D. Pendse | 2016-04-12 | |
| 9276140 | Imager module with interposer chip | — | 2016-03-01 | $48,892,000 |
| 9241097 | Camera module including image sensor die in molded cavity substrate | — | 2016-01-19 | $76,302,000 |