Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406619 | Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die | Reza A. Pagaila, Byung Tai Do | 2016-08-02 |
| 9337161 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-05-10 |
| 9293385 | RDL patterning with package on package system | Reza A. Pagaila, Byung Tai Do | 2016-03-22 |
| 9257357 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2016-02-09 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang, Nathapong Suthiwongsunthorn | 2016-01-12 |