| 9508635 |
Methods of forming conductive jumper traces |
HanGil Shin, HeeJo Chi |
2016-11-29 |
| 9496152 |
Carrier system with multi-tier conductive posts and method of manufacture thereof |
HeeJo Chi, HanGil Shin |
2016-11-15 |
| 9397050 |
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant |
HanGil Shin, HeeJo Chi |
2016-07-19 |
| 9362161 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package |
HeeJo Chi, HanGil Shin |
2016-06-07 |
| 9355939 |
Integrated circuit package stacking system with shielding and method of manufacture thereof |
HeeJo Chi, HanGil Shin |
2016-05-31 |
| 9299650 |
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof |
HeeJo Chi, HanGil Shin, Kyung-Moon Kim |
2016-03-29 |
| 9269691 |
Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer |
HeeJo Chi, HanGil Shin |
2016-02-23 |
| 9269595 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint |
HeeJo Chi, HanGil Shin |
2016-02-23 |
| 9263332 |
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
HeeJo Chi, HanGil Shin |
2016-02-16 |