Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | HeeJo Chi, HyungMin Lee | 2016-07-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391046 | Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer | HeeJo Chi, HyungMin Lee | 2016-07-12 |