Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252032 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | DaeSik Choi, WonJun Ko | 2016-02-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252032 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | DaeSik Choi, WonJun Ko | 2016-02-02 |