Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9279673 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | SeungYong Chai, OhHan Kim, GwangTae Kim, Kenny Lee | 2016-03-08 |
| 9252032 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | DaeSik Choi, JaEun Yun | 2016-02-02 |