Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349666 | Integrated circuit packaging system with package stacking | In Sang Yoon, DaeSik Choi | 2016-05-24 |
| 9330945 | Integrated circuit package system with multi-chip module | Sungmin Song, SeungYun Ahn, Jong-Woo Ha | 2016-05-03 |