Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385066 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | DeokKyung Yang, Sungmin Song | 2016-07-05 |
| 9349666 | Integrated circuit packaging system with package stacking | JoHyun Bae, DaeSik Choi | 2016-05-24 |