Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385066 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | In Sang Yoon, Sungmin Song | 2016-07-05 |
| 9230898 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | HanGil Shin, Jong-Woo Ha | 2016-01-05 |