Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324659 | Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die | SungWon Cho, DaeSik Choi, DongSoo Moon | 2016-04-26 |