Issued Patents 2016
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524955 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Rui Huang, Heap Hoe Kuan, Yaojian Lin | 2016-12-20 |
| 9524938 | Package-in-package using through-hole via die on saw streets | Byung Tai Do, Heap Hoe Kuan | 2016-12-20 |
| 9515016 | Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant | Rui Huang, Il Kwon Shim, Heap Hoe Kuan | 2016-12-06 |
| 9508621 | Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP | Yaojian Lin, Il Kwon Shim | 2016-11-29 |
| 9299648 | Integrated circuit packaging system with patterned substrate and method of manufacture thereof | Il Kwon Shim, Heap Hoe Kuan | 2016-03-29 |
| 9293350 | Semiconductor package system with cavity substrate and manufacturing method therefor | Rui Huang, Heap Hoe Kuan | 2016-03-22 |
| 9275877 | Semiconductor device and method of forming semiconductor package using panel form carrier | Yaojian Lin, Rui Huang, Heap Hoe Kuan | 2016-03-01 |
| 9257356 | Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices | Rui Huang, Heap Hoe Kuan, Yaojian Lin | 2016-02-09 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Lee Sun Lim, Rui Huang, Xusheng Bao, Ma Phoo Pwint Hlaing | 2016-02-02 |
| 9252066 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Il Kwon Shim, Yaojian Lin | 2016-02-02 |
| 9240380 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seung Uk Yoon | 2016-01-19 |