Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397058 | Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration | Xusheng Bao, Jian Zuo | 2016-07-19 |
| 9252172 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Seng Guan Chow, Lee Sun Lim, Rui Huang, Xusheng Bao | 2016-02-02 |