Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385009 | Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP | Yaojian Lin, Rui Huang, Kang Cheng | 2016-07-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385009 | Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP | Yaojian Lin, Rui Huang, Kang Cheng | 2016-07-05 |