Issued Patents 2011
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067268 | Stacked integrated circuit package system and method for manufacturing thereof | Flynn Carson, BumJoon Hong, Seongmin Lee | 2011-11-29 |
| 8049322 | Integrated circuit package-in-package system and method for making thereof | Choong Bin Yim, Hyeog Chan Kwon | 2011-11-01 |
| 8039942 | Ball grid array package stacking system | — | 2011-10-18 |
| 8039365 | Integrated circuit package system including wafer level spacer | Sang Ho Lee, Soo-San Park | 2011-10-18 |
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DaeSik Choi, DeokKyung Yang, Byoung Wook Jang, JaeSick Bae, Seung-Won Kim | 2011-08-09 |
| 7968373 | Integrated circuit package on package system | Joosang Kim, DongSoo Moon | 2011-06-28 |
| 7951643 | Integrated circuit packaging system with lead frame and method of manufacture thereof | TaeWoo Kang, DongSoo Moon | 2011-05-31 |
| 7927917 | Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-04-19 |
| 7915724 | Integrated circuit packaging system with base structure device | Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho, Jeffrey D. Punzalan +2 more | 2011-03-29 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon | 2011-02-15 |
| 7884460 | Integrated circuit packaging system with carrier and method of manufacture thereof | Choong Bin Yim, Hyeog Chan Kwon | 2011-02-08 |
| 7872340 | Integrated circuit package system employing an offset stacked configuration | DaeSik Choi, BumJoon Hong, Sang Ho Lee, Soo-San Park | 2011-01-18 |