Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067268 | Stacked integrated circuit package system and method for manufacturing thereof | Flynn Carson, Jong-Woo Ha, Seongmin Lee | 2011-11-29 |
| 7872340 | Integrated circuit package system employing an offset stacked configuration | DaeSik Choi, Sang Ho Lee, Jong-Woo Ha, Soo-San Park | 2011-01-18 |