Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067828 | System for solder ball inner stacking module connection | Chan Hoon Ko | 2011-11-29 |
| 8067307 | Integrated circuit package system for stackable devices | DaeSik Choi, Sang Ho Lee | 2011-11-29 |
| 8039365 | Integrated circuit package system including wafer level spacer | Sang Ho Lee, Jong-Woo Ha | 2011-10-18 |
| 8004073 | Integrated circuit packaging system with interposer and method of manufacture thereof | Chan Hoon Ko | 2011-08-23 |
| 7968995 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Chan Hoon Ko, HeeJo Chi | 2011-06-28 |
| 7923290 | Integrated circuit packaging system having dual sided connection and method of manufacture thereof | Chan Hoon Ko, YoungChul Kim | 2011-04-12 |
| 7872340 | Integrated circuit package system employing an offset stacked configuration | DaeSik Choi, BumJoon Hong, Sang Ho Lee, Jong-Woo Ha | 2011-01-18 |
| 7863761 | Integrated circuit package system with molding vents | Dal Jae Lee, Nam Ju Cho, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin +3 more | 2011-01-04 |