Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067828 | System for solder ball inner stacking module connection | Soo-San Park | 2011-11-29 |
| 8004073 | Integrated circuit packaging system with interposer and method of manufacture thereof | Soo-San Park | 2011-08-23 |
| 7968995 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Soo-San Park, HeeJo Chi | 2011-06-28 |
| 7923290 | Integrated circuit packaging system having dual sided connection and method of manufacture thereof | Soo-San Park, YoungChul Kim | 2011-04-12 |