SH

Sungpil Hur

SC Stats Chippac: 1 patents #96 of 188Top 55%
📍 Yeoju-si, KR: #1 of 1 inventorsTop 100%
Overall (2011): #156,975 of 364,097Top 45%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7863761 Integrated circuit package system with molding vents Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Hyeong Kug Jin +3 more 2011-01-04