Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863761 | Integrated circuit package system with molding vents | Dal Jae Lee, Soo-San Park, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin +3 more | 2011-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863761 | Integrated circuit package system with molding vents | Dal Jae Lee, Soo-San Park, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin +3 more | 2011-01-04 |