Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067307 | Integrated circuit package system for stackable devices | Sang Ho Lee, Soo-San Park | 2011-11-29 |
| 8063475 | Semiconductor package system with through silicon via interposer | DeokKyung Yang, Seung-Won Kim | 2011-11-22 |
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof | JoHyun Bae, SungWon Cho | 2011-10-18 |
| 8008121 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | Jongho Kim, HyungMin Lee | 2011-08-30 |
| 7994625 | Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof | DeokKyung Yang, Jong-Woo Ha, Byoung Wook Jang, JaeSick Bae, Seung-Won Kim | 2011-08-09 |
| 7943252 | Battery module of improved safety and middle or large-sized battery pack containing the same | Hee Soo Yoon, Dal-Mo Kang, HanHo Lee, Jeeho Kim, Jongmoon Yoon +5 more | 2011-05-17 |
| 7923304 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | JoHyun Bae, Junghoon Shin | 2011-04-12 |
| 7872340 | Integrated circuit package system employing an offset stacked configuration | BumJoon Hong, Sang Ho Lee, Jong-Woo Ha, Soo-San Park | 2011-01-18 |