Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030769 | Grooving bumped wafer pre-underfill system | Sungyoon Lee, Taewoo Lee | 2011-10-04 |
| 7923304 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DaeSik Choi, JoHyun Bae | 2011-04-12 |
| 7892072 | Method for directional grinding on backside of a semiconductor wafer | Sungyoon Lee, BoHan Yoon | 2011-02-22 |